Investigation of electrodeposited Ni-based coatings for biodiesel storageBOONYONGMANEERAT, Yuttanant; SUKJAMSRI, Chamaiporn; SAHAPATSOMBUT, Ukrit et al.Applied energy. 2011, Vol 88, Num 3, pp 909-913, issn 0306-2619, 5 p.Article

Potere livellante nell' elettrodeposizione = Pouvoir nivelant du dépôt électrolytique = Leveling power of electrodepositionBERTORELLE, E.Galvanotecnica. 1985, Vol 36, Num 11, pp 277-282, issn 0016-4240Article

Future trends in electroplating for the electronics industry = Tendances dans le dépôt électrolytique pour l'industrie électroniqueCHRISTIE, I. R.Transactions of the Institute of Metal Finishing. 1986, Vol 64, Num 2, pp 47-51, issn 0020-2967Article

Electrodeposition of catalytically active nickel powder from sulphate baths: effect of some operating variablesABD EL-HALIM, A. M; KHALIL, R. M.Surface technology. 1985, Vol 26, Num 4, pp 343-351, issn 0376-4583Article

Surface micromachined metallic microneedlesCHANDRASEKARAN, Shankar; BRAZZLE, John D; FRAZIER, A. Bruno et al.Journal of microelectromechanical systems. 2003, Vol 12, Num 3, pp 281-288, issn 1057-7157, 8 p.Article

The design of rack plating systems = Conception des systèmes de revêtement en rateliersMCCORMICK, M; HOWE, P. D.Transactions of the Institute of Metal Finishing. 1986, Vol 64, Num 1, pp 39-41, issn 0020-2967Article

Spongy electrodeposit formation = Formation d'un dépôt électrolytique spongieuxPOPOV, K. I; KRSTAJIC, N. V; POPOV, S. R et al.Journal of applied electrochemistry. 1986, Vol 16, Num 5, pp 771-774, issn 0021-891XArticle

Make and break properties of electrodepositsGROSSMANN, H; HUCK, M; SCHAUDT, G et al.IEEE transactions on components, hybrids, and manufacturing technology. 1985, Vol 8, Num 1, pp 70-79, issn 0148-6411Article

Trends in plating shops = Tendances dans les ateliers de placageMOONEY, T.Plating and surface finishing. 1985, Vol 72, Num 12, pp 20-21, issn 0360-3164Article

Copper electrodeposition onto moving high resistance electroless films = Dépôt électrolytique de cuivre sur des films chimiques mobiles à haute résistanceD'AMICO, J. F; DEANGELO, M. A; MCLARNON, F. R et al.Journal of the Electrochemical Society. 1985, Vol 132, Num 10, pp 2330-2336, issn 0013-4651Article

Cubic millimeter power inductor fabricated in batch-type wafer technologySAIDANI, Menouer; GIJS, Martin A. M.Journal of microelectromechanical systems. 2003, Vol 12, Num 2, pp 172-178, issn 1057-7157, 7 p.Article

The role of sensors in automatic electroplating = Rôle des détecteurs en dépôt électrolytique automatiqueTURNER, D. R.Plating and surface finishing. 1986, Vol 73, Num 6, pp 30-34, issn 0360-3164Article

Nickel electroplating: prospects for growth = Dépôt électrolytique de nickel: perspectives de croissanceDIBARI, G. A.Plating and surface finishing. 1985, Vol 72, Num 12, pp 52-54, issn 0360-3164Article

Prévision de l'évolution d'un microprofil sinueux en régime d'égalisation négativeKRUGLIKOV, S. S; YARLYKOV, M. M; STARKOVA, N. N et al.Èlektrohimiâ. 1985, Vol 21, Num 10, pp 1372-1376, issn 0424-8570Article

La métallisation électrochimique: un outil à déposer le métal. II: Installations, matériels et solutions = Electrochemical metalization: a tool for metal coatings. II: plants, materials and solutionsRUBINSTEIN, M.Galvano-organo (Paris). 1983, Vol 52, Num 537, pp 711-714, issn 0302-6477Article

L'ordinateur, un outil au service du galvanoplaste = The computer a tool in the service of electroplatingRUIMI, M.Galvano organo traitements de surface. 1986, Vol 55, Num 565, pp 257-258, issn 0982-7870Article

GALVANOTECNICA: CHE CASA DA E CHECOSA CHIEDERLE = ELECTROCOATING = DEPOTS ELECTROLYTIQUESJOZWIAK EL JR.1982; TRATT. FINIT.; ISSN 0041-1833; ITA; DA. 1982; VOL. 22; NO 4; PP. 33-37; 3Article

STRUCTURE OF DEPOSITS AND ELECTROPLATINGS, PRODUCED FROM COBALT PLATING ELECTROLYTE AND ELECTROLYTES WITH NA₂WO₄, MNSO₄, NH₄H₂PO₂, NAVO₃PARFENOV VA; RACHINSKAS VS.1980; DARB.-LIET. TSR MOKSLU AKAD. SER. B; ISSN 0132-2729; SUN; DA. 1980; NO 3; PP. 35-43; ABS. LIT; BIBL. 9 REF.Article

EFFECT OF CODEPOSITION OF POLYMER ON THE MORPHOLOGY OF ELECTRODEPOSITED COPPERDESPIC AR; MAGLIC GS; JACOVIC M et al.1979; J. APPL. ELECTROCHEM.; GBR; DA. 1979; VOL. 9; NO 2; PP. 147-153; BIBL. 5 REF.Article

ELECTRODEPOSITION OF COPPER ON A COPPER SINGLE-CRYSTAL (100) FACE AND ON A COPPER POLYCRYSTALLINE SURFACE IN THE PRESENCE OF SULPHAGUANIDINESUBRAMANIAN K; NAGESWAR S.1979; SURF. TECHNOL.; CHE; DA. 1979; VOL. 9; NO 2; PP. 103-109; BIBL. 12 REF.Article

SELECTED PROBLEMS IN THE CONTINUOUS ELECTRODEPOSITION OF NI-FE ALLOYSBIELSINSKI J; PRZYLUSKI J.1979; SURF. TECHNOL.; CHE; DA. 1979; VOL. 9; NO 1; PP. 53-64; BIBL. 15 REF.Article

THE MEASUREMENT AND INTERPRETATION OF THE MACROSTRESS GENERATED DURING THEE LECTRODEPOSITION OF COPPERHARRISON JA; STRONACH PJ.1979; ELECTROCHIM. ACTA; GBR; DA. 1979; VOL. 24; NO 2; PP. 191-194; BIBL. 27 REF.Article

ELECTRODEPOSITION DU TUNGSTENEVAS'KO AT; PATSYUK FN; VASIL'EV MA et al.1979; UKRAIN. KHIM. ZH.; UKR; DA. 1979; VOL. 45; NO 1; PP. 10-14; BIBL. 4 REF.Article

ELECTRODEPOSITION OF CAB₆.UCHIDA K.1978; SURF. TECHNOL.; SWITZ.; DA. 1978; VOL. 7; NO 1; PP. 39-44; BIBL. 15 REF.Article

MECHANICAL FINISHING COMBINES WITH PLATING TO MEET SPECIALIZED NEEDS1978; PLATG SURF. FINISHG; USA; DA. 1978; VOL. 65; NO 11; PP. 20-22; (2 P.)Article